With a low dielectric constant (Dk) and dissipation factor, XtremeSpeed RO1200 materials provide outstanding signal integrity, reduced signal skew and reduced cross-talk. Combined with superior thermal/mechanical performance, low CTE and a halogen free UL 94 V-0 rating, XtremeSpeed RO1200 materials are well suited for the most demanding high layer count applications.


  • Low Dk
  • Max dissipation factor of .0017 (Laminate) and .0012 (Bondply) at 10GHz
  • Low CTE, Decomposition Temperature (Td) of 500°C TGA
  • Low profile rolled copper cladding on laminates
  • Spread glass reinforced laminates for improved rigidity and ease of handling
  • Unreinforced bondply enables best-in-class electrical performance
  • Halogen free


  • Outstanding signal integrity (SI)
  • Excellent thermal/mechanical performance characteristics
  • Lead-free process compatible
  • Reduced signal skew
  • Ideal for high layer count structures



View current applications of this product line.


Explore our calculators, conversion tools, technical papers and more.


Samples can be requested through our online request system.

Sample Requests


Advanced Electronics Solutions

Find local representatives for personalized support.